Replications approaches require fabrication of mould or master and we describe different methods of mould manufacture, including mechanical (micro-cutting ultrasonic machining), energy-assisted methods (electrodischarge machining, micro-electrochemical machining, laser ablation, electron beam machining, focused ion beam (FIB) machining), traditional micro-electromechanical systems (MEMS) processes, as well as mould fabrication approaches for curved surfaces. Here, we describe direct and replication approaches for manufacturing of polymer microfluidic devices. Polymer based microfluidic devices offer particular advantages including those of cost and biocompatibility. Martin Jaggi & Prof.Microfluidic devices offer the potential to automate a wide variety of chemical and biological operations that are applicable for diagnostic and therapeutic operations with higher efficiency as well as higher repeatability and reproducibility. Summer School: Powder Diffraction School – PSI, Villigen.2018 CCMX Advanced Course: Instrumented Nanoindentation.CCMX – NCCR MARVEL Materials Science Day 2018.CCMX – ScopeM Advanced Course: Combining Structural & Analytical Investigations of Matter at the Micro-, Nano and Atomic Scale.CCMX Winter School – Surface Science: Fundamentals, Properties and Selected Applications.CCMX Advanced Course: Inorganic Particle Synthesis by Precipitation.Carbon Composites Schweiz Conference – “Thermoplastic Composites”.2019 Advanced Course: From Additive Manufacturing to Field-Assisted Sintering.2019 Advanced Course: Powder Characterisation and Dispersion – from nanometers to millimeters and from theory to practice. 2019 Summer School – Characterization of Materials.2019 Advanced Course: Instrumented Nanoindentation.2019 CCMX – NCCR MARVEL Materials Science Day.Tech Apero – Smart Fibers for Wearable Sensors and Drug Delivery.2019 Advanced Course: Introduction to scanning electron microscopy microanalysis techniques.2020 Winter School “Nanoparticles: from fundamentals to applications in life sciences”.2020 Inorganic Particle Synthesis by Precipitation: From Nanoparticles to Self-organised Mesocrystals and from Theory to Practice.2020 CCMX – ScopeM Advanced Course: Advanced Characterization of Materials at the Micro-, Nano- and Atomic Scale.2021 CCMX Advanced Course: Powder Characterisation and Dispersion – from nanometers to millimeters and from theory to practice.2021 CCMX Characterization of Materials Summer School.2021 Summer School: Tribology and Surfaces Interactions.2021 Advanced Course: Advanced X-Ray Diffraction Methods for Coatings: Strain, Defects and Deformation Analysis of Thin Films.2021 Advanced Course: Introduction to scanning electron microscopy microanalysis techniques.EPFL – AMI course: Nanoparticles, from fundamentals to applications.2022 CCMX Advanced Course: Instrumented Nanoindentation.2022 CCMX – ScopeM Course: Advanced Characterization of Materials at the Micro-, Nano and Atomic Scale.ROBUSPIC (ROBUst mixed signal design methodologies for Smart Power ICs).LOGMATIC, local pspice simulation and design support.Dolphin Integration: download ekv3 in smash.COMON ( COmpact MOdelling Network): Marie Curie Actions-Industry-Academia Partnerships and Pathways (IAPP).EKV 3.0 model code & parameter extraction.The code is available on request, just contact us! Using the EKV Verilog-A code the ekv 2.6/3.0 models have been implemented into number of the GNU and commercial simulations tools including listed above. We are supporting the model coded in VHDL-AMS and Verilog-A. W.Grabinski, T.Gneiting “Power/HVMOS Devices Compact Modeling” ISBN: 978-9-0 (2010)Ĭomplex Mixed-signal 1.0 um BiCMOS Technologyĭigital & Mixed-signal 0.5 um CMOS EPROM/OTPĭigital & Mixed-signal 0.5 um CMOS (high temperature)ĭigital & Mixed-signal 0.5 um CMOS (high radiation tolerance).‘The HV-EKV MOSFET Model’ CMC Meeting, Boston 8th May 2006.Presentation at EKV Model Users’ Group Meeting and Workshop, November 4-5 2004, EPFL, Lausanne. Bucher, EKV3.0 Model Code, Parameters & Case Studies, on Mixed Design (MIXDES 2005), Krakow, Poland, 22-25 June 2005 Yoshitomi, “Challenges of Compact Modeling for Deep-Submicron RF-CMOS Devices” 12th Int.Conf. on Mixed Design, (MIXDES 2007), Ciechocinek, 21-23 June 2007 Bucher, “EKV3 Parameter Extraction and Characterization of 90nm RF-CMOS Technology” 14th Int.Conf. Enz, EKV3 MOSFET Compact Model Documentation, Model Version 301.02, Technical Report, Technical University of Crete, 16 July 2008. “The EPFL-EKV MOSFET Model Equations for Simulation” can be downloaded as PDF file (133kB).
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